pcb technologist expert consultant resume
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Resume of BKI Consultant
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  • PCB Technology
  • Surface Mount Technology
  • New Product and Manufacturing Technology

This expert has a B.S. in Chemical and Ocean Engineering from the University of Rhode Island in Kingston, RI.

PCB Technologist Expert Consultant Resume

This expert specializes in PCB technology, global PCB strategy development and implementation, new product and manufacturing technology development. Further expertise includes SME for Circuit Pack Assembly (CPA) and PCB specification requirements and responsibility for reviewing ASCOM specification changes for CPA and PCB issues.

Additionally, this consultant offers expertise related to Design for Manufacturability (DFM) engineering on new product design and component selection and qualification to assure product reliability and compatibility with manufacturing capabilities. Other areas of capability include specifying reliability qualification, moisture sensitivity and component quality requirements, as well as development and implementation of new manufacturing process technology.

This expert offers experience as a senior process engineer specializing in surface mount technology development, and has extensive experience in areas including automated gold finger plating, cupric chloride and ammonia based etching, chemical distribution, and solderability preservation processes.

Other more specific areas of expertise include development of CSP Technology manufacturing process, evaluation and implementation of Immersion Silver final finish, PCB vendor qualification for PCA processes, and introduction of BGA Repair Technology manufacturing process. This expert also has experience with cutting edge convection reflow oven systems, and development and evolution of SMT manufacturing process.

Consultant, Kevin Kennedy Associates Inc.

Providing expertise in PCB technology, new product and manufacturing technology development, SME for Circuit Pack Assembly (CPA) and PCB specification requirements, Design for Manufacturability (DFM) engineering on new product design and component selection and qualification to assure product reliability and compatibility with manufacturing capabilities, and related expertise to a wide variety of clients.

 

PCB Technologist, Lucent Technologies; Alcatel-Lucent (ALU)

Was responsible for Global PCB Strategy development and implementation. Provided successful oversight and transfer to low cost region of majority (~ 90 % ) of PCB spend. This consultant had primary responsibility for former Lucent PCB specifications and was a key contributor to present ALU effort. Was responsible for review and approval of DFM requirements for new PCB codes; and for capability assessment of existing and potential PCB fabrication sites. Worked with strategic suppliers to increase the scope of their qualification and technology to meet present and anticipated product requirements. Primary responsibility was for business commodity management of PCBs post merger. Was a key contributor for Lucent, realizing significant year over year cost savings on PCBs, overseeing resolution of all quality issues related to PCB and subject matter expect (SME) resource for Circuit Pack Assembly. Completed numerous site assessments and corporate audits of PCB supply base on a global basis. Worked closely with one supplier to insure capability to solder bond PCBs to either copper or aluminum pallets for power amplifier product.

 

Distinguished Member of Technical Staff (DMTS), New Product and Manufacturing Technology Development, Lucent Technologies – AT&T, Optical Networking Group, North Andover, MA

Responsibilities included SME for Circuit Pack Assembly (CPA) and PCB specification requirements and responsibility for reviewing ASCOM specification changes for CPA and PCB issues. Was assigned to New Product Engineering Technology Development responsible for concurrent Design for Manufacturability (DFM) engineering with Bell Laboratories Design Organizations on new product design and component selection and qualification to assure product reliability and compatibility with manufacturing capabilities. Also assigned to New Product Introduction (NPI) Engineering interface to Bell Laboratories Design and components engineering organizations; responsible for specifying reliability qualification, moisture sensitivity and component quality requirements. Served as Manufacturing Technology Team Leader responsible for development and implementation of new manufacturing process technology; and ONG Representative to Lucent Corporate Surface Mount and Soldering Forum. Was responsible for co-development and support of Circuit Pack Manufacturing Technology Roadmap for ONG business unit; served as ONG Representative to Lucent SNS Technology Exchange Forum.

 

Senior Process Engineer (MTS), Surface Mount Technology Development, Lucent Technologies – AT&T, Optical Networking Group, North Andover, MA

Served as PCB specialist responsible for evaluating process impact of new PCB vendors, identifying and resolving cutover issues and providing process engineering approval. Provided primary impetus for evaluation and implementation of immersion silver as the PCB surface finish of choice for Lucent. Provided CPA responsibility for MV introduction of designs with HDI and microvias. Also responsible for manufacturing technology development and implementation including process evaluation and design, process development, and experimentation for Surface Mount Technology. Had primary responsibility for CPA’s ISO14000 chemical usage and energy management requirements; facility procurement, shop layout, shop documentation and training, and process support for Surface Mount Fine Pitch and Flexible component assembly. Responsibilities also include development and support of reflow soldering systems, cleaning equipment, BGA repair, SMT repair, etc., and New Product DFM on all new product introductions.

 

Process Engineer (MTS-1), VISION Process Center – Surface Mount Technology, Lucent Technologies – AT&T, Optical Networking Group, North Andover, MA

Provided capacity planning, process quality improvements, and Surface Mount Technology process development. Responsibilities also include facility procurement, shop layout, shop documentation and training, and process support for medium volume/high product mix Surface Mount assembly line. Other responsibilities included development and support of reflow soldering systems, cleaning equipment, BGA repair, SMT repair, etc., and New Product DFM on all new product introductions.

 

Planning Engineer – PCB Process Engineer, AT&T – Western Electric, Printed Wiring Board Facilities – Richmond, VA and N. Andover, MA

Introduced first operational horizontal HASL facility in US. Optimized Gyrex horizontal HASL system resulting in significant yield improvement and cost reduction. Introduced first Imidazole process in North America. Process responsibilities also included Automated Gold Finger Plating, Cupric Chloride and Ammonia based Etching, Chemical Distribution for factory, various solderability preservation processes. Development, facility procurement, shop layout, shop documentation and training, and process support. Responsible for principal role in development of CSP Technology manufacturing process; Principal role in evaluation and implementation of Immersion Silver final finish; Principal role in introduction of BGA Technology manufacturing process; Principal role in PCB vendor qualification for PCA processes; Principal role in introduction of BGA Repair Technology manufacturing process. Introduced cutting edge convection reflow oven systems. Had principal role in development and evolution of SMT manufacturing process.

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FEATURED CONSULTANT

Peter Habicht, Lead Consultant
Peter specializes in welding and metallurgical engineer with 40 years industry experience in commercial nuclear power plant construction.

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